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Talking about RFID Electronic Label Packaging Technology

Talking about RFID Electronic Label Packaging Technology

  • 2019/11/15

RFID radio frequency identification is a non-contact automatic identification technology. It automatically recognizes target objects and acquires relevant data through radio frequency signals. The identification work can work in various harsh environments without manual intervention. RFID technology can recognize high-speed moving objects and recognize multiple labels at the same time, which is quick and easy to operate.

The basic components of an RFID system The most basic RFID system consists of three parts: a tag, a reader, and an antenna. A complete system also requires a data transmission and processing system.

The basic working principle of RFID technology is not complicated: after the tag enters the magnetic field, it receives the RF signal from the reader, transmits the product information stored in the chip by the energy obtained by the induced current, or actively transmits the signal of a certain frequency; After reading and decoding the information, the reader sends it to the central information system for data processing.

Label packaging process RFID tags, different uses have different packaging forms, so the process of packaging process is also diverse.

(1) Antenna manufacturing
The antenna substrate (corresponding to the wire bond package) is printed on the antenna substrate (corresponding to the flip chip conductive adhesive package) to etch the antenna substrate (corresponding to the wire bond package or the module riveted package)

(2) Formation of bumps
The use of flexible bump making technology has the characteristics of low cost, high packaging efficiency, convenient use, flexibility, simple process control and high degree of automation. It not only solves the urgently needed problems of variable processing batch, high density and low cost packaging in the microelectronics industry, but also provides conditions for the flexible production of RFID tags that are currently booming.

(3) RFID chip interconnection method
One of the main goals of manufacturing RFID tags is to reduce costs. To this end, the process should be reduced as much as possible, low-cost materials should be selected, and process time should be reduced. There are three ways to interconnect flip chip bumps with flexible substrate pads:

Isotropic conductive paste (ICA) with underfill,Anisotropic conductive adhesive (ACA, ACF) directly presses the nail head bump Non-conductive adhesive (NCA) directly presses the nail head bump;

In theory, NCA interconnection should be given priority, and it can be used in conjunction with glue bumps to achieve low-cost manufacturing, but this method has certain limitations. With ICA, the advantage is low cost, no need for pressurization for curing, but the operation process steps are cumbersome, usually the curing time is long, and it is difficult to increase the production speed.

It is preferred to first make a small substrate connected to the chip and then connect it with a large-sized antenna substrate to complete the circuit conduction through the adhesion of the ICA. Usually, low-cost, fast-curing ACF and ACA are used. The common method is to apply a layer of ACA to the corresponding position of the antenna substrate pad by ordinary stencil printing technology, and place the chip in the corresponding position by using a flip chip mounter. It is then cured by hot pressing. Or the RFID module is first manufactured and then riveted and assembled with the antenna substrate.


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